The Homogenous Dissipative file is use in static control area and cleanroom to hold production traveler chart, process chart, engineering drawing.
SPECIFICATION
PHYSICAL (TYPICAL)
Material |
Polyethylene Terephthalate Glycol |
Specification |
Surface Resistivity – 8 * 10 to power of 8 |
Static Decay Rate |
+5000V to 50V : 0.01 seconds at 12% R.H. |
Tribocharge(Nitrile Glove) |
10 volts – using ESD Test Method |
ROHS FOR HOMOGENOUS FILE (RING BINDER) & CLIP BOARD
Material |
Yes/No |
If Yes, in what concentration(mg/kg= ppm)? |
Asbestos and its compounds |
No |
|
Azo dyes/colorants |
No |
|
Cadmium and its compounds |
No |
|
Chlorinated paraffins, short-chained(10 – 13 Carbon Chain, Cl=50% wt or more) |
No |
|
Chromium Vl and its compounds |
No |
|
Ozone Depleting Substances |
No |
|
Halogenated flame retardants/additives |
No |
|
Lead and its compounds |
No |
|
Mercury and its compounds |
No |
|
Nickel and its compounds |
No |
|
Polybrominated Biphenyls (PBB’S) and their Ethers/Oxides (PBDE’s, PBBE’s) |
No |
|
Polychlorinated Biphenyls (PCB’s) and Terphenyls (PCT’s) |
No |
|
Organic Tin Compounds |
No |
|
Formaldehyde |
No |
|
Polychlorinated napthalene’s(PCN) |
No |
|
Mirex (perchlorodecone) |
No |
|
Polyvinyl chloride (PVC) |
No |
|
Hexavalent Chromium compounds |
No |
|
Antimony and its compounds |
No |
|
Arsenic and its compounds |
No |
|
Beryllium and its compounds |
No |
|
Bismuth and its compounds |
No |
|
Nickel and its compounds |
No |
|
Selenium and its compounds |
No |
|
Magnesium (including alloys) |
No |
|
Copper and its compounds |
No |
|
Gold and its compounds |
No |
|
Palladium and its compounds |
No |
|
Silver and its compounds |
No |
|
Inquiry - ESD HOMOGENOUS DISSIPATIVE FILE (RING BINDER)