USHIO UMA-1002-HC93FS is an advanced metrology-grade exposure equipment designed for the technical needs of semiconductor device manufacturers. This system integrates a number of leading-edge technologies to provide superior exposure monitoring capabilities for wafer characterization, defect inspection, advanced lithography, and other high-end chip manufacturing processes. At the heart of USHIO UMA 1002-HC93FS is an advanced proprietary exposure control unit. This machine makes intelligent decisions to automatically adjust parameters during the exposure process to maintain optimal exposure quality, delivering reliable results within tight tolerances. The tool also supports sophisticated user-control over E-Towns and E-Line temperaturesfor precise control of re-useable materials. The asset is equipped with a robust and powerful array of optics systems to detect defects and accurately measure wafers. The optics uses a combination of F-theta scanning technology, half-tone pattern recognition, and wafer tilt measurement capabilities to quantify the quality of the exposure. This model can also accurately measure defects which are smaller than 50 nanometers in size. The equipment is also calibrated to function with the majority of exposure tools and wafer types, including multiple layers which may have a different aspect ratio. To maximize the life expectancy and safety of the operators, UMA-1002-HC 93 FS is equipped with an array of safety features.