Probe Features:
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Prevents DPS damage.
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No need to solder or glue the thermocouple to the PCB.
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It reduces labor costs, assembly and disassembly takes only a few seconds.
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Gets reliable profiles - high pressure and low thermal mass give a fast and reliable response.
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Wet solder paste profiling - profile of the first pass of the PCB through the oven.
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Temperature monitoring anywhere - the small and durable tip of the thermocouple fits even in tight spaces.
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More accurate results with no additional material (solders or epoxy) used to attach the thermocouple.
Inquiry - E45-0783-78
